InhaltsangabeIntroduction - Reza Ghodssi and Pinyen Lin.- The MEMS Design Process - Tina Lamers and Beth Pruitt.- Additive Processes for Semiconductors and Dielectric Materials - Chris Zorman, Robert C. Roberts and Li Chen.- Additive Processes for Metals - David Arnold, Monika Saumer and Yong Kyu-Yoon.- Additive Processes for Polymeric Materials - Ellis Meng, Xin Zhang, and William Benard.- Additive Processes for Piezoelectric Materials - Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga.- Materials and Processes in Shape-Memory Alloy - Takashi Mineta and Yoichi Haga.- Dry Etching for Micromachining Applications - Srinivas Tadigadapa and Franz Laermer.- MEMS Wet-Etch Processes and Procedures - David Burns.- MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi.- Doping - Alan D. Raisanen.- Wafer Bonding - Shawn Cunningham and Mario Kupnik.- MEMS Packaging Materials - Ann Garrison Darrin and Robert Osiander.- Surface Treatment and Planarization - Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yongqing Lan.- MEMS Process Integration - Michael Huff, Stephen Bart, and Pinyen Lin.

Introduction - Reza Ghodssi and Pinyen Lin.- The MEMS Design Process - Tina Lamers and Beth Pruitt.- Additive Processes for Semiconductors and Dielectric Materials - Chris Zorman, Robert C. Roberts and Li Chen.- Additive Processes for Metals - David Arnold, Monika Saumer and Yong Kyu-Yoon.- Additive Processes for Polymeric Materials - Ellis Meng, Xin Zhang, and William Benard.- Additive Processes for Piezoelectric Materials - Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga.- Materials and Processes in Shape-Memory Alloy - Takashi Mineta and Yoichi Haga.- Dry Etching for Micromachining Applications - Srinivas Tadigadapa and Franz Laermer.- MEMS Wet-Etch Processes and Procedures - David Burns.- MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi.- Doping - Alan D. Raisanen.- Wafer Bonding - Shawn Cunningham and Mario Kupnik .- MEMS Packaging Materials - Ann Garrison Darrin and Robert Osiander.- Surface Treatment and Planarization - Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yongqing Lan.- MEMS Process Integration - Michael Huff, Stephen Bart, and Pinyen Lin.